A network of tiny pipes of water could be used to cool next-generation PC chips, researchers at IBM have said.The reason is an amazing quantity of power consumed by new multi-layered IBM chips:
Each 4 sq cm sandwich is just 1mm thick but pumps out close to 1kilowatt - equivalent to that generated by a hotplate.And the solution looks eerily familiar*:
![](https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEjOPGuwZoEtF7VW2KqAdALHLfhCF5nTlWFpA6xABhgU3rkrirQc8GAF9L9QqaIxBfoIBxZCtkH8B6bMmU2ATtejd2J81v3VJgSq9iz_8RkRpkRU-Wk_crmUBlCGPQ-BCzjPv3-AzA/s400/Chip.jpg)
It looks like a dream of many a computer programmer come true: a PC that is a coffeemaker.
(*) At lest for a computer dinosaur like I. The dimensions of the water piping are different, otherwise it is the good ole IBM 360 CPU all over again. Well, almost.